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Etching Process
Dielectrics Etch
Gallium Nitride Etch
Indium Phosphide Etch
Silicon Nitride Etch
Silicon Oxide Etch
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Indium Phosphide Etch
Plasma-Therm RIE
Temperature:
25 - 40 °C
Gases:
CH
4
- 10 sccm
H
2
- 40 sccm
Pressure:
30 mTorr
Power:
200 W
DC-bias:
440 V
Etch Rate:
400 Å/min
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