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Processing
Equipment Baseline
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Processing Fundamentals
Doping Process
Etching Process
Lithography
Metrology
Substrate Cleaning
Thermal Processing
Thin Film
Dielectrics Deposition (non-thermal)
Diamond-Like Carbon
Oxide & Nitride Films
Silicon Nitride
Silicon Oxide
Silicon Oxynitride
RF Sputterer Dielectrics
Silicon Carbide
Metal Deposition Process
Thermal Growth
Processing Information
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Silicon Oxynitride
Unaxis PECVD
Temperature:
200 - 350 °C
Gases:
SiH
4
(100%) - 6 sccm
N
2
- 1200 sccm NH
3
- 30 sccm N
2
O - 30 sccm
Pressure:
900 mTorr
Power:
35 W
Deposition Rate:
100 - 250 Å/min
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