|
Method
|
Advantages
|
Disadvantages
|
|
E-Beam Evaporation
|
-
Handles high temp materials.
-
Good for liftoff.
-
Highest purity.
|
-
Some CMOS processes are sensitive to radiation
-
Alloys are difficult.
-
Poor step coverage.
|
|
Filament Evaporation
|
-
Simple to implement
-
Good for liftoff.
|
-
Unable to handle high temp materials.
-
Alloys are difficult.
-
Poor step coverage.
|
|
Sputtering
|
-
Improved step coverage
-
Good for alloys.
-
Handles high temp materials.
-
Less radiation damage.
|
-
Film quality not as good (possible grainy/porous films)
-
Plasma damage/contamination
|
Thin Film Evaporation Reference
Titanium
Titanium Nitride(TiN)