| |
Time Slot |
Group A |
Group B |
| Monday |
1:00 - 1:15 |
Gowning |
Gowning |
| |
1:15 - 1:30 |
Woollam Nitride Measurement |
Spin Coating (SCS-small) |
| |
1:30 - 2:00 |
|
|
| |
2:00 - 2:30 |
Spin Coating (SCS-small) |
Exposure/Develop |
| |
2:30 - 3:00 |
|
Descum (Vision RIE 2) |
| |
3:00 - 3:30 |
Exposure/Develop |
Metal Deposition |
| |
3:30 - 4:00 |
Descum (Vision RIE 2) |
(CHA) |
| |
4:00 - 4:30 |
CMOS/Furnace |
Woollam Nitride Measurement |
| |
4:30 - 5:00 |
|
|
| |
|
|
|
| Tuesday |
1:00 - 1:15 |
Gowning |
Gowning |
| |
1:15 - 2:00 |
Metal Deposition |
Lift-off |
| |
2:00 - 2:30 |
(CHA) |
|
| |
2:30 - 3:00 |
Profilometry (Dectek) |
Oxide deposition |
| |
3:00 - 3:30 |
|
(Oxford) |
| |
3:30 - 4:00 |
Lift-off |
Spin Coating (SCS-small) |
| |
4:00 - 4:30 |
|
|
| |
4:30 - 5:00 |
Oxide deposition |
Exposure/Develop |
| |
5:00 - 5:30 |
(Oxford) |
|
| |
|
|
|
| Wednesday |
1:00 - 1:15 |
Gowning |
Gowning |
| |
1:15 - 2:00 |
|
Etching (vision) |
| |
2:00 - 2:30 |
photolithography |
|
| |
2:30 - 3:00 |
|
wafer clean |
| |
3:00 - 3:30 |
|
|
| |
3:30 - 4:00 |
Etching (vision) |
CMOS/Furnace |
| |
4:00 - 4:30 |
|
|
| |
4:30 - 5:00 |
wafer clean |
Characterization Center Tour |
| |
5:00 - 5:30 |
|
(Marcus) |