IEN - Micro/Nano Fabrication Facility
STS HRM ICP
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Equipment Description

The Georgia Tech STS HRM is a CMOS-Compatible tool used for integrated MEMS-CMOS processes, and is meant for narrow (<10 micron in width) high aspect-ratio trench etching for 4" or 6" silicon (DRIE) and SOI wafers and a high etch rate. Non-CMOS-compatible materials and masks are NOT allowed in this tool.

Functions

  • MEMS-CMOS processes
  • Narrow high aspect-ratio trench etching

Materials etched

  • Si, SOI wafers

Masks

  • SiO2 , SixNy

Photoresists

  • SC1800 series, SPR220 from Shipley, AZ4000 series from Clariant, NPR from Futurex

​Coil

  • 3000W 13.56MHz AEI

Platen

  • HF: 500W 13.56MHz ENI
  • LF: 500W 380KHz AEI LF5

HBC w/ ESC

Gases

  • SF6 , C4F8 , Ar, O2, CO2

Process Pressure

  • 5-80mTorr

Substrate

  • small pieces (with carrier wafer) - 6” wafers

Temperatures

  • -20˚C-100˚C

Recent Service/Modification

  • Attempted backup of HDD, always fails, slipstream needed to recover.
  • Wafer mapping failures. Resolved by replacing IR wafer detector.
  • Intermittent failures of interlock chain. Resolved by replacing soldered relay on I/O board.
  • Power supply serviced. Spare purchased.
Institute Georgia Tech
Department IEN - Micro/Nano Fabrication Facility
Sub Tool Of
Marcus Inorganic Cleanroom
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