The Georgia Tech STS HRM is a CMOS-Compatible tool used for integrated MEMS-CMOS processes, and is meant for narrow (<10 micron in width) high aspect-ratio trench etching for 4" or 6" silicon (DRIE) and SOI wafers and a high etch rate. Non-CMOS-compatible materials and masks are NOT allowed in this tool.
Functions
- MEMS-CMOS processes
- Narrow high aspect-ratio trench etching
Materials etched
Masks
Photoresists
- SC1800 series, SPR220 from Shipley, AZ4000 series from Clariant, NPR from Futurex
Coil
Platen
- HF: 500W 13.56MHz ENI
- LF: 500W 380KHz AEI LF5
HBC w/ ESC
Gases
Process Pressure
Substrate
- small pieces (with carrier wafer) - 6” wafers
Temperatures
Recent Service/Modification
- Attempted backup of HDD, always fails, slipstream needed to recover.
- Wafer mapping failures. Resolved by replacing IR wafer detector.
- Intermittent failures of interlock chain. Resolved by replacing soldered relay on I/O board.
- Power supply serviced. Spare purchased.