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Equipment Capabilities
Assembly
Environmental Testing
Inspection
Substrate Fabrication
Automatic Surface Planer
Centrifuge
Convection Oven - 419
Convection Oven DX400
Copper Etching System
Copper Etching System - Differential
Desmear Plating Process
Electroless Copper Plating Line
Electrolytic Plating Line Tank 10
Electrolytic Plating Line Tank 7
Laser Via Drilling System
Mask Aligner and Exposure System
N2 Vacuum Oven - CR
N2 Vacuum Oven - Materials
Nitrogen Oven - Cleanroom
Nitrogen Oven 419 Lab
Ozone Generation System
Photoresist Developer
Planarization System
Plasma Cleaning System
Plating Bath Analyser
Projection Lithography System
Roll Jar Mill
Roll Laminator
Single Level Hot Press
Small Scale Plating - Surface Finish
Spin Coater in Hood
Mask Aligner and Exposure System
Information
Schedule
Training
Equipment Description
This system performs broad band UV exposure for 12 inch or smaller substrates using mylar masks.
Institute
Georgia Tech
Department
IEN - Packaging Research Center
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