IEN - Packaging Research Center
Laser Via Drilling System
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Equipment Description

Cornerstone laser drilling system for the creation of 8um and larger vias in polymers.  This system can handle larger than 12 inch substrates and can process at approximately 10,000 vias per second. 355nm uv laser at 16W maximum power operating at 80MHz repetition rate.

Institute Georgia Tech
Department IEN - Packaging Research Center
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