IEN - Packaging Research Center
Electroless Copper Plating Line
Information
Schedule
Training
Equipment Description

The Electroless Plating Line provides chemical desmear process and electroless copper plating of 300mm panels. This tool is only available to Packaging Research Center researchers at this time. When scheduling, note the number and size of boards, which process is being run (1-22 full line, 1-6 desmear, or 5-22 eless), and material (glass, si, fr4, etc)

Please fill this form to request desmear or electroless plating.

https://sums.gatech.edu/articles/Desmear

 

Institute Georgia Tech
Department IEN - Packaging Research Center
Contact Information