IEN - Packaging Research Center
Electrolytic Plating Line Tank 7
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Equipment Description

The Electrolytic Plating Line Tank-7 provides electrolytic copper plating of blind micro vias and through holes in  300mm panels. This tool is only available to Packaging Research Center researchers at this time. When scheduling, note the number and size of boards, which process is being run and substrate material (glass, si, fr4, etc)

Institute Georgia Tech
Department IEN - Packaging Research Center
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