Below you can find information on the top 20 tools that users can access at IEN. For availability, training, process, or contact information regarding specific tools, follow the links below each image to see the tool in the Shared User Management System (SUMS) Database
The next generation 3D laser lithography system, Photonic Professional GT sets new standards in 3D micro printing and maskless lithography. It combines two writing modes in one device: an ultra-precise piezo mode for arbitrary 3D trajectories (FBMS) and the high-speed galvo mode (MBFS) for fastest structuring in a layer-by-layer fashion. In combination with the software package, the system is embedded best along the 3D printing workflow and offers a high degree of automation for direct manufacturing. In addition, the Photonic Professional GT allows for the fabrication of high-resolution photo masks and other direct write applications.
Location: Marcus Organic Cleanroom
See this tool in the SUMS database here.
The STS Pegasus ICP is a deep reactive ion etcher (DRIE) with a dual plasma source design. It is designed to etch silicon through a Bosch Process. The process allows the sample to have a more uniform, anisotropic etch on 4" wafers. The STS Pegasus ICP is unique and provides users with high etch rates, excellent uniformity, and results in a highly concentrated and uniformed distribution of radicals.
Location: Pettit Inorganic Cleanroom
The SiGe Nanowire furnace is configured for depositing Si nanowires from metal nanoparticles such as Au. Substrate material is typically Si. Samples are heated via infrared lamps from top and bottom.
Location: Marcus Inorganic Cleanroom
The CVD FirstNano Graphene furnace is currently configured for graphene on Cu foil, graphene sublimation from SiC samples (epitaxial graphene), and H2 etch clean of samples. Samples are heated via 10kW RF induction heating.
The Schmid APCVD is an atmospheric pressure roller furnace designed to deposit phosphorous or boron doped SiO2, undoped SiO2, and Al2O3. A second chamber is available for in-situ SiO2 encapsulation immediately after the initial deposition layer.
Black Magic PECVD is Plasma-Enhanced Chemical Vapor Deposition (PECVD) equipment for deposition of high quality carbon nanotube (CNT), carbon nanoribbon (CNR) and graphene thin films
The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. The Unifilm Sputterer has a deposition monitor to quickly and accurately measure Source distributions, a computer-controlled Planetary System, and a computer model of the source-planetary system.
The Cambridge Fiji Plasma Atomic Layer Deposition (ALD) system uses ALD precursors to deposit pin-hole free films in ultra-high aspect ratio features. Film thickness can be controlled to within 1nm.
The M-2000® is a versatile spectroscopic ellipsometer, suited to many different sample types. Coatings can be dielectrics, organics, semiconductors, and even thin metals.
The LaserWriter system by MICROTECH is designed for the definition of planar geometries and for surface diagnostics, in applications where maximum resolutions down to 0.7 µm are required.
The system transforms a laser beam into a controlled writing tool for photolithographic mask fabrication or for direct in situ processing on planar substrates. Besides microlithographic applications, its optical apparatus and substrate motion management are also well suited for surface inspection or diagnostics. Hence, the same machine can be used first for producing a pattern and later for inspecting the results. The patterns are generated by accurately moving the target (mask or substrate) underneath a focused and scanning laser beam with proper wavelength.
SUSS MicroTec's proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures.
The AltaSpray technology is capable of coating 90° corners, KOH cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes it the ideal choice for R&D, MEMS, 3D-integration and Wafer Level Packaging applications such as 3D image sensor packaging.
The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. It has the capabilities for anodic, silicon fusion, adhesive, and thermal compression bonding for wafers that are up to 6".
Biacore T200 is a versatile, label-free system for studies of biomolecular interactions. Obtain high quality kinetics from the fastest on-rates to slowest off-rateAnalyze interactions involving the smallest low molecular weight compounds.
Material confocal microscope with fixed laser wavelength of 405nm with magnification ranges:108x – 17,280x. X-Y plane resolution:~ 120nm, height resolution: ~ 20-30nm. Measurement modes: profile, area/volume, surface roughness, geometric, film thickness
The Q600 provides simultaneous measurement of weight change (TGA) and true differential heat flow (DSC) on the same sample from ambient to 1,500 °C. It features a field-proven horizontal dual beam design with automatic beam growth compensation, and the ability to analyze two TGA samples simultaneously. DSC heat flow data is dynamically normalized using the instantaneous sample weight at any given temperature.
The Thermo Scientific Nicolet iS50 FT-IR spectrometer gives definitive answers in your analytical workload. The iS50 enables users of various skill levels to obtain results at the push of a button in applications ranging from drug and polymer development to forensic analysis and art conservation.
This table-top ink-jet microdispensing and printing platform is useful for a wide variety of applications. Typical inks include polymers, adhesives, metallic nanoparticles, and biological materials, including diagnostic reagents, proteins, and DNA. As a non-contact printing process, the accuracy of ink-jet dispensing is not affected by how the fluid wets a substrate, and the fluid source cannot be contaminated by materials on the substrate. In addition, the ability to free-fly fluid droplets allows the fluid to be dispensed into and onto non-planar and complex structural features.
See this tool in the SUMS database here
The Hitachi S-3700N Variable Pressure SEM features a low vacuum observation of 6–270 Pa (7mT-2Torr) which enables imaging of non-conductive samples (dielectrics) and wet/moist samples such as cultured cells, without traditional sample preparation (gold coating/drying). A Deben Coolstage controls sample temperature between -10F and 120F to control sample vapor pressure.
The SCS Labcoter PDS 2010 is a vacuum system used for conformal vapor deposition of Parylene at room temperature. Typical deposition thicknesses range from 1um to 50um. Parylene-C and Parylene-N dimers are provided. As a high quality, compact coating unit, the PDS 2010 is well suited for a range of applications, including circuit boards, sensors, wafers, medical devices and elastomeric components for research, development and repair.