Substrate Requirement:

Substrate size: up to 8" (200mm) wafers, or smaller pieces

Substrate material: Si, fused silica, quartz, metal, ceramic only. No polymer.

Procedure:

Substrate pre-treatment:

Sample will be cleaned with standard solvent clean procedure before loaded into processing equipment

Processing chamber clean:

Processing chamber will cleaned by running clean recipe for 45 min

Processing chamber conditioning:

A pre-deposition will be ran for 10 min to condition the processing chamber.

Sample processing:

A standard recipe will ran to deposit desired thickness to sample substrate.

Sample inspection:

Sample will be inspected with metrology tools to confirm the quality.

Process Baseline:

Unaxis PECVD

STS PECVD 3