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Dicing Services
Service Description
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Service Description
The IEN Dicing Saw is capable of dicing wafers up to 6" in diameter. It can cut a variety of materials including silicon, glass, silicon carbide, sapphire, and quartz. Depending on the material, thicknesses of samples can range between 200um to 3mm, and die sizes can range from 1mm x 1mm up to cutting the sample in half. Samples must be cut all the way across.
Related Links
Dicing Equipment
Dicing Saw Training Video
Related Media
IEN Dicing Service Request Form
Contact Information
Ben Hollerbach - 404 894-3447
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