The Georgia Tech Denton Discovery RF/DC Sputterer is configured for thin film deposition of up to 4 materials sequentially without breaking vacuum. The system is equipped with four 3" DC target positions and one 3” RF targets. Target #1 is dual power and can run either DC or RF power.

Function

• DC and RF Sputtering System

Materials Deposited

• Cu, Ti, Al, Cr, ITO, SiO2, Si, Al203

Component Specifications

• Four 3” Sputtering Guns
• All four can sputterer with DC Power
• Only Station 1 can sputter with RF Power

Gases

• Ar, N2, O2

Substrate Size

• Single substrate up to 6” wafer

Process Pressure

• 5mTorr

Temperature

• Heater can heat sample up to 400C

Vendor Specified Capabilities

• Heated sample holder
• RF Bias
• Sample rotation
• Multigun DC and RF Sputtering System
• Load lock system
• Automatic sample loading